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CARBON NANO
EFFICIENT HEAT-DISSIPATING COMPOSITE MATERIAL FOR CHIPS
Description:
This product is composed of Nano materials and thermal functional materials
Applications:
Suitable for passive cooling equipment in small confined spaces, precision instruments, high-power functional equipment, generators, 5G and artificial intelligence.
Product Features:
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Meet the shock 500V & Performance requirement for insulation withstand voltage of 2500V/5mA
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Electrostatic protection meets air 15kV and content 8kV requirements
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Meet IP54 protection level
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Material product emissivity ≥90%
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Strong heat dissipation capacity, effectively cooling more than 10℃

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