EFFICIENT HEAT-DISSIPATING COMPOSITE MATERIAL FOR CHIPS
This product is composed of Nano materials and thermal functional materials
Suitable for passive cooling equipment in small confined spaces, precision instruments, high-power functional equipment, generators, 5G and artificial intelligence.
Meet the shock 500V & Performance requirement for insulation withstand voltage of 2500V/5mA
Electrostatic protection meets air 15kV and content 8kV requirements
Meet IP54 protection level
Material product emissivity ≥90%
Strong heat dissipation capacity, effectively cooling more than 10℃