CARBON NANO
EFFICIENT HEAT-DISSIPATING COMPOSITE MATERIAL FOR CHIPS

Description:

This product is composed of Nano materials and thermal functional materials

 

Applications:

Suitable for passive cooling equipment in small confined spaces, precision instruments, high-power functional equipment, generators, 5G and artificial intelligence.

 

Product Features:

  • Meet the shock 500V & Performance requirement for insulation withstand voltage of 2500V/5mA

  • Electrostatic protection meets air 15kV and content 8kV requirements

  • Meet IP54 protection level

  • Material product emissivity ≥90%

  • Strong heat dissipation capacity, effectively cooling more than 10℃

EC-Blog-Image19.jpg