CARBON NANO
EFFICIENT HEAT-DISSIPATING COMPOSITE MATERIAL FOR CHIPS

Description:

This product is composed of Nano materials and thermal functional materials

 

Applications:

Suitable for passive cooling equipment in small confined spaces, precision instruments, high-power functional equipment, generators, 5G and artificial intelligence.

 

Product Features:

• Meet the shock 500V & Performance requirement for insulation withstand voltage of 2500V/5mA

• Electrostatic protection meets air 15kV and content 8kV requirements

• Meet IP54 protection level

• Material product emissivity ≥90%

• Strong heat dissipation capacity, effectively cooling more than 10℃